Introduction
We are seeking an experienced Physical Design Engineer to join our team developing next-generation AI acceleration SoCs and chiplets at EdgeCortix. In this role, you will play a key part in driving synthesis, timing closure, and design optimization in close collaboration with our RTL, architecture, and external implementation partners. This is an exciting opportunity to contribute to cutting-edge silicon development that powers advanced AI systems at the edge.
The Team
As a team, we are working to define and solve the hardest problems in AI including computer vision, speech, and natural language, geared towards real-time capabilities on small to medium-form factor devices. We originated out of multiple years of research, as such at our core we value learning, intellectual curiosity, and self-starters. We have the ambitious goal of enabling cloud-level performance with significantly better energy efficiency for AI inference at the edge.
About EdgeCortix
EdgeCortix is a deep-tech, fabless semiconductor startup revolutionizing edge computing with artificial intelligence and high-efficiency system-on-chip (SoC) design. Founded on years of advanced research, our proprietary hardware-software co-design methodology and Dynamic Neural Accelerator® AI processor IP are reshaping the AI hardware space. Headquartered in Tokyo, Japan, we also operate in Singapore, the United States (California and Virginia), and India.
Your Role and Responsibilities
As a Physical Design Engineer, you will contribute to the implementation of our next-generation AI acceleration SoCs and chiplets. As part of small internal PD team, you will be responsible for driving key aspects of the front-end synthesis experiments to determine optimal PPA operating point and taking the IPs through Place and Route flow through close collaboration with RTL design and architecture teams. The sign-off activities and regular P&R progress has to be closely collaborated with our external implementation partners.
This role emphasizes synthesis, timing analysis, floorplanning, power optimization, and design closure, with a strong focus on communication and coordination across internal and external teams.
Key Responsibilities
- Drive and maintain RTL-to-GDSII flow, focusing on synthesis, STA, and design closure. Knowledge of DVFS, MMMC is important
- Strong Synthesis knowledge essential. Able to conduct multiple experiments at Synthesis and take it to P&R and provide feedback to IP teams
- Define floorplans and block partitioning strategies for hierarchical designs.
- Coordinate with external vendors for backend P&R execution; review their outputs for quality and correctness.
- Analyze timing paths and lead STA closure across PVT corners and operating modes.
- Develop and optimize physical constraints (SDC, TCL) and run equivalence checks.
- Placement analysis, congestion analysis, Clock Tree implementation experience needed
- Evaluate standard cell libraries and implementation methodologies to improve PPA.
- Implement low-power design strategies using UPF (Unified Power Format).
- Review power grid planning and sign-off reports (IR-drop, EM).
- Drive ECO implementation based on RTL changes or timing requirements.
- Collaborate with internal RTL and architecture teams to improve logic and system-level PPA.
- Participate in early feasibility studies and contribute to PPA projections.
- Maintain and improve internal automation scripts and flows.
Minimum Qualifications
- Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
- 5+ years of experience in physical design of SoCs with a focus on synthesis and timing.
- Proficiency in STA and synthesis tools (e.g., Primetime, Design Compiler, Genus).
- Familiarity with backend flows and interaction with P&R teams (internal or external).
- Good scripting skills (TCL, Python, Shell).
- Experience working with advanced technology nodes ( 12nm and below).
Preferred Qualifications
- Master’s degree in relevant field.
- 8–10+ years of experience in physical design or chip implementation.
- Prior experience coordinating with remote backend implementation teams.
- Experience in chiplet architecture or hierarchical SoC designs.
- Understanding of sign-off checks (LVS, DRC), IR-drop, crosstalk, and EM analysis.
- Proficiency in UPF-based low-power flows and ECO handling.
- Strong communication and project coordination skills.
What’s in it for you?
Make a difference: you will have the opportunity to join a well-funded fabless AI semiconductor startup that is disrupting the AI software and hardware co-design space. Be an integral part of its growth and momentum.
Location
Hyderabad is the primary work location, Bangalore is also available.
Hybrid Remote working is allowed.
Benefits and Perks
- Highly competitive salary and stock options
- Flex work time
- Top-tier employee benefits
